NXP Semiconductors - RZ3135B50W

RZ3135B50W by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number RZ3135B50W
Description NPN; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): 125 W; Maximum Collector Current (IC): 5.7 A; Package Shape: RECTANGULAR;
Datasheet RZ3135B50W Datasheet
NAME DESCRIPTION
Minimum Power Gain (Gp): 5.2 dB
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Maximum Collector Current (IC): 5.7 A
Configuration: SINGLE
Transistor Element Material: SILICON
Sub-Category: Other Transistors
Polarity or Channel Type: NPN
Surface Mount: YES
No. of Terminals: 2
Qualification: Not Qualified
Maximum Power Dissipation (Abs): 125 W
Terminal Position: DUAL
Package Style (Meter): FLANGE MOUNT
JESD-30 Code: R-CDFM-F2
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: FLAT
Highest Frequency Band: S BAND
Maximum Operating Temperature: 200 Cel
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