NXP Semiconductors - P82B96DP,118

P82B96DP,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P82B96DP,118
Description BUS BUFFERS; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
Datasheet P82B96DP,118 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.1 mm
Sub-Category: Other Interface ICs
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: BIPOLAR
JESD-30 Code: S-PDSO-G8
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Interface IC Type: BUS BUFFERS
Width: 3 mm
Moisture Sensitivity Level (MSL): 1
Maximum Supply Voltage: 15 V
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
Qualification: Not Qualified
Package Equivalence Code: TSSOP8,.19
Length: 3 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/15
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