NXP Semiconductors - P1010NXE5KHA

P1010NXE5KHA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P1010NXE5KHA
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;
Datasheet P1010NXE5KHA Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.9 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: Tin/Silver (Sn/Ag)
No. of Terminals: 425
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
No. of DMA Channels: 4
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B425
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
No. of External Interrupts: 4
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA425,23X23,32
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1
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