NXP Semiconductors - MIMXRT1051DVL6BR

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

STM32MP157AAD3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 64 MHz, suitable for industrial applications requiring low power consumption. With 48 DMA channels and boundary scan support, it offers high performance in a compact square package.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 361; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.1 V;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;

AM3357BZCZD60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 26 MHz max clock frequency. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 90 °C.

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.8 V;