MIMX8QM6AVUFFAB by NXP Semiconductors | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MIMX8QM6AVUFFAB
Description	MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 1313; Package Code: FBGA; Package Shape: SQUARE;
Datasheet	MIMX8QM6AVUFFAB Datasheet

NAME	DESCRIPTION
Minimum Supply Voltage:	1.05 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.1 V
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	2.52 mm
Surface Mount:	YES
Maximum Supply Current:	5000 mA
Terminal Finish:	TIN
No. of Terminals:	1313
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
No. of I/O Lines:	1
Address Bus Width:	0
Technology:	CMOS
RAM Words:	524288
JESD-30 Code:	S-PBGA-B1313
Maximum Clock Frequency:	24 MHz
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	FBGA
Width:	29 mm
Moisture Sensitivity Level (MSL):	3
Peripheral IC Type:	MULTIFUNCTION PERIPHERAL
Maximum Supply Voltage:	1.15 V
Boundary Scan:	YES
External Data Bus Width:	0
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Length:	29 mm
Additional Features:	lsio contains 8 GPIO lines
Peak Reflow Temperature (C):	260
Bus Compatibility:	CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
Terminal Pitch:	.75 mm
Temperature Grade:	AUTOMOTIVE

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