NXP Semiconductors - MC68360CAI25L

MC68360CAI25L by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC68360CAI25L
Description SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Terminal Form: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; External Data Bus Width: 32;
Datasheet MC68360CAI25L Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 4.1 mm
Surface Mount: YES
Terminal Finish: TIN
On Chip Data RAM Width: 8
No. of Terminals: 240
No. of Serial I/Os: 7
Terminal Position: QUAD
Package Style (Meter): FLATPACK, FINE PITCH
No. of DMA Channels: 2
Address Bus Width: 32
Maximum Data Transfer Rate: 1.25 MBps
Technology: CMOS
RAM Words: 2560
JESD-30 Code: S-PQFP-G240
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: FQFP
Width: 32 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: QFP240,1.3SQ,20
Length: 32 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: SCC, SMC, SPI, UART
Terminal Pitch: .5 mm
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