NXP Semiconductors - MC33218ADW

MC33218ADW by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC33218ADW
Description SPEAKER PHONE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet MC33218ADW Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Seated Height: 2.65 mm
Sub-Category: Telephone Circuits
Surface Mount: YES
Maximum Supply Current: 6 mA
Terminal Finish: TIN LEAD
No. of Terminals: 24
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: BIPOLAR
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: SOP
Width: 7.5 mm
Telecom IC Type: SPEAKER PHONE CIRCUIT
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOP24,.4
Length: 15.4 mm
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 5
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