MC33215FB by NXP Semiconductors | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC33215FB
Description	TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE;
Datasheet	MC33215FB Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	TELEPHONE SPEECH CIRCUIT
Maximum Seated Height:	2.45 mm
Surface Mount:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
JESD-609 Code:	e0
Minimum Operating Temperature:	-20 Cel
No. of Functions:	1
No. of Terminals:	52
Qualification:	Not Qualified
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Length:	10 mm
JESD-30 Code:	S-PQFP-G52
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	70 Cel
Peak Reflow Temperature (C):	220
Package Code:	QFP
Width:	10 mm
Terminal Pitch:	.65 mm
Temperature Grade:	COMMERCIAL
Moisture Sensitivity Level (MSL):	1

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