NXP Semiconductors - MC13109AFB

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MC13109AFB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC13109AFB
Description CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK;
Datasheet MC13109AFB Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.6 V
Telecom IC Type: CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Maximum Seated Height: 2.45 mm
Surface Mount: YES
Maximum Supply Current: 12 mA
Minimum Operating Temperature: -20 Cel
No. of Functions: 1
No. of Terminals: 52
Package Equivalence Code: QFP52,.52SQ
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Length: 10 mm
JESD-30 Code: S-PQFP-G52
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Width: 10 mm
Terminal Pitch: .65 mm
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