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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LS1027AXE7PQA |
| Description | MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | LS1027AXE7PQA Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .97 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.61 mm |
| Surface Mount: | YES |
| No. of Terminals: | 448 |
| No. of Serial I/Os: | 8 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| No. of I/O Lines: | 68 |
| Address Bus Width: | 14 |
| Technology: | CMOS |
| RAM Words: | 262144 |
| JESD-30 Code: | S-PBGA-B448 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | FBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
| Maximum Supply Voltage: | 1.03 V |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA448,30X30,30 |
| Length: | 17 mm |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | I2C, SAI, SPI, UART |
| Terminal Pitch: | .75 mm |
| Temperature Grade: | INDUSTRIAL |
