NXP Semiconductors - LPC1837JET100E

LPC1837JET100E by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC1837JET100E
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;
Datasheet LPC1837JET100E Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.2 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
ADC Channels: YES
No. of Terminals: 100
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
No. of I/O Lines: 49
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B100
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
ROM Words: 1048576
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 9 mm
Moisture Sensitivity Level (MSL): 3
Speed: 180 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 139264
External Data Bus Width: 0
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA100,10X10,32
Length: 9 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5/3.3
CPU Family: CORTEX-M3
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