NXP Semiconductors - BAP55L

BAP55L by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP55L
Description PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP55L Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Diode Resistive Test Frequency: 100 MHz
Config: SINGLE
Diode Type: PIN DIODE
Frequency Band: S BAND
Diode Resistive Test Current: .5 mA
Sub-Category: PIN Diodes
Surface Mount: YES
No. of Terminals: 2
Terminal Position: BOTTOM
Maximum Diode Capacitance: .28 pF
Package Style (Meter): CHIP CARRIER
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PBCC-N2
Minimum Breakdown Voltage: 50 V
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: .7 ohm
Nominal Minority Carrier Lifetime: .28 us
Reverse Test Voltage: 0 V
Nominal Diode Capacitance: .27 pF
Diode Element Material: SILICON
Qualification: Not Qualified
Maximum Power Dissipation: .5 W
Application: ATTENUATOR; SWITCHING
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