NXP Semiconductors - AFSC5G23D37T2

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

MAX4003EUA-T by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

Infineon's OC2321VQFN8XTMA2 is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40°C to 105°C, suitable for RF and baseband circuits. The PLASTIC/EPOXY material, NO LEAD terminal form, and 1.8V supply voltage make it ideal for compact mobile devices.

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

Telit LE910C1EU06T060100 is a CELL IC with 181 terminals, MICROELECTRONIC ASSEMBLY package style, and RF/BASEBAND CIRCUIT type. Operating from -40 to 85°C, it's ideal for telecom applications requiring a 3.8V supply voltage in compact designs with dimensions of 28.2mm x 28.2mm x 2.2mm.

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

AT86RF233-ZUR by Microchip Technology is a cellphone IC with 32 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a compact square shape ideal for telecom applications.

BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

Nordic Semiconductor's NRF9160-SICA-B1A-R7 is a surface-mount Cellphone IC with 127 terminals in a rectangular grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 3.8V, making it ideal for telecom devices.

RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;