National Semiconductor - LM556J-MIL

LM556J-MIL by National Semiconductor

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Manufacturer National Semiconductor
Manufacturer's Part Number LM556J-MIL
Description PULSE; RECTANGULAR; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet LM556J-MIL Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Maximum Time At Peak Reflow Temperature (s): 40
Width (mm): 7.62 mm
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Sub-Category: Analog Waveform Generation Functions
Surface Mount: NO
Terminal Finish: Tin/Lead (Sn63Pb37)
No. of Terminals: 14
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Screening Level: MIL-STD-883
Technology: BIPOLAR
JESD-30 Code: R-GDIP-T14
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Nominal Supply Voltage (Vsup): 5 V
Moisture Sensitivity Level (MSL): 1
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
No. of Functions: 2
Qualification: Not Qualified
Package Equivalence Code: DIP14,.3
Other IC type: PULSE; RECTANGULAR
Length: 19.43 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 16 V
Power Supplies (V): 5/15
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