Microsemi - MT88L70AE1

MT88L70AE1 by Microsemi

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Manufacturer Microsemi
Manufacturer's Part Number MT88L70AE1
Description DTMF SIGNALING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet MT88L70AE1 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Seated Height: 5.33 mm
Sub-Category: Telecom Signaling Circuits
Surface Mount: NO
Maximum Supply Current: 5.5 mA
Terminal Finish: MATTE TIN
No. of Terminals: 18
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Width: 7.62 mm
Telecom IC Type: DTMF SIGNALING CIRCUIT
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP18,.3
Length: 22.86 mm
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3
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