Microsemi - A3P600-FGG256I

A3P600-FGG256I by Microsemi

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Manufacturer Microsemi
Manufacturer's Part Number A3P600-FGG256I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet A3P600-FGG256I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: PLASTIC/EPOXY
Organization: 13824 CLBS, 600000 GATES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.8 mm
Surface Mount: YES
Position Of Terminal: BOTTOM
No. of Terminals: 256
No. of Equivalent Gates: 600000
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 350 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: INDUSTRIAL
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of CLBs: 13824
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)
Length: 17 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250
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