Microchip Technology - SY55857LKG

SY55857LKG by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number SY55857LKG
Description LVDS TO PECL TRANSLATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
Datasheet SY55857LKG Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.1 mm
Output Latch/Register: NONE
Surface Mount: YES
Maximum Supply Current: 45 mA
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 10
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-30 Code: S-PDSO-G10
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Interface IC Type: LVDS TO PECL TRANSLATOR
Width: 3 mm
Moisture Sensitivity Level (MSL): 2
No. of Bits: 1
Output Polarity: COMPLEMENTARY
Maximum Supply Voltage: 3.6 V
Maximum Delay: .4 ns
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
Qualification: Not Qualified
Package Equivalence Code: TSSOP10,.20,20
Length: 3 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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