Microchip Technology - SAM9X60-V/DWB

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

The Microchip Technology ATSAMA5D33A-CUR is a 32-bit microprocessor with integrated cache and a max clock frequency of 48 MHz. It is commonly used in industrial applications due to its low power mode, wide temperature range (-40 to 85 °C), and high number of DMA channels (39).

Texas Instruments DM3730CBPD100 microprocessor features 32-bit architecture, 1.2V supply voltage, and 54MHz clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE; No. of External Interrupts: 1;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 354; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;

NXP's MIMXRT1176AVM8A microprocessor features integrated cache, 48 MHz clock frequency, and 32 DMA channels. Ideal for automotive applications, it operates b/w -40 to 125 °C with low power mode and floating-point format support.

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; No. of I/O Lines: 9; JESD-609 Code: e1; Bus Compatibility: I2C; SPI; UART; USB; Qualification: Not Qualified;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;

MICROPROCESSOR, RISC; No. of Terminals: 425; Technology: CMOS; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3; Bit Size: 32;

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

LS1012AXN7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address and data bus width, operating at up to 25 MHz. Ideal for industrial applications, it features low power mode, integrated cache, and boundary scan support for efficient performance in compact designs.