Microchip Technology - MCP23009-E/MG

MCP23009-E/MG by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number MCP23009-E/MG
Description PARALLEL IO PORT, GENERAL PURPOSE; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet MCP23009-E/MG Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: .9 mm
Sub-Category: Parallel IO Port
Surface Mount: YES
Maximum Supply Current: 1 mA
Terminal Finish: MATTE TIN
No. of Terminals: 16
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
No. of I/O Lines: 8
Screening Level: TS 16949
Technology: CMOS
JESD-30 Code: S-PQCC-N16
Maximum Clock Frequency: 10 MHz
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Package Code: HVQCCN
Width: 3 mm
Moisture Sensitivity Level (MSL): 1
No. of Bits: 8
No. of Ports: 1
Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE
Maximum Supply Voltage: 5.5 V
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: LCC16,.12SQ,20
Length: 3 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 2/5
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