Microchip Technology - M2S090-FCSG325I

M2S090-FCSG325I by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number M2S090-FCSG325I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA325,21X21,20;
Datasheet M2S090-FCSG325I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.16 mm
No. of Inputs: 180
Surface Mount: YES
No. of Outputs: 180
Position Of Terminal: BOTTOM
No. of Terminals: 325
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-30 Code: R-PBGA-B325
Package Shape: RECTANGULAR
Maximum Operating Temperature: 100 Cel
Package Code: TFBGA
Width: 11 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 86184
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA325,21X21,20
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 13.5 mm
Form Of Terminal: BALL
Pitch Of Terminal: .5 mm
Peak Reflow Temperature (C): 250
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