Microchip Technology - KSZ8873MLLAM

KSZ8873MLLAM by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number KSZ8873MLLAM
Description LAN SWITCHING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet KSZ8873MLLAM Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: LAN SWITCHING CIRCUIT
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 64
Qualification: Not Qualified
Package Equivalence Code: QFP64,.47SQ,20
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Screening Level: AEC-Q100; TS 16949
Length: 10 mm
JESD-30 Code: S-PQFP-G64
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: LFQFP
Width: 10 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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