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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | BM77SPPS3MC2-0007AA |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: XMA; Package Shape: RECTANGULAR; |
| Datasheet | BM77SPPS3MC2-0007AA Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.86 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -20 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 30 |
| Package Equivalence Code: | MODULE,30LEAD(UNSPEC) |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Data Rate: | .1125 Mbps |
| Length: | 15 mm |
| JESD-30 Code: | R-XXMA-N30 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | XMA |
| Width: | 12 mm |
| Terminal Pitch: | 1.1 mm |
| Temperature Grade: | COMMERCIAL |
