Microchip Technology - BM71BLES1FC2-0B05BA

TELECOM CIRCUIT;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;

The U-blox Ag ZED-F9P-02B is a GNSS module with 54 terminals, operating temperature range of -40 to 85°C. It is surface mountable and designed for industrial applications requiring precise positioning and timing accuracy. The TS 16949 screening level ensures high quality standards for telecom interfaces.

Silicon Labs' MGM12P32F1024GA-V4 is a TELECOM CIRCUIT IC with 3.3V supply voltage, 1 Mbps data rate, and operating temperatures from -40 to 85 °C. Its RECTANGULAR package shape makes it ideal for telecom interface applications.

Murata's CMWX1ZZABZ-093 is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a metal package body for industrial use and is surface mountable. Ideal for telecom circuits, this rectangular microelectronic assembly has no lead terminals.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Quectel Wireless Solutions' L86-M33 is a telecom IC with 12 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. With a compact square package style and no-lead terminal form, it's ideal for space-constrained telecom interfaces.

Other Telecom ICs;

TRF7970ARHBR by Texas Instruments is a telecom IC with 32 terminals, operating at 5V. It has a data rate of 0.848 Mbps and can withstand temperatures from -40 to 110°C. Ideal for telecom circuits, it comes in a square chip carrier package suitable for surface mounting applications.

TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Width: 10.16 mm;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: SON; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.

TELECOM CIRCUIT; Peak Reflow Temperature (C): 250;

TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: Tin (Sn);

The Intel PEF7072HLV16SLLHN is a telecom interface IC with 64 terminals in a rectangular flatpack package. Its gull wing terminal form and quad position make it suitable for telecom circuit applications. This surface-mount device is made of plastic/epoxy, ideal for various telecommunications functions.