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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS3172+ |
| Description | FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | DS3172+ Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 2.54 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .328 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 400 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Telecom IC Type: | FRAMER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA400,20X20,50 |
| Length: | 27 mm |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3.3 |
