Maxim Integrated - DS28CM00R-A00+T

FT245RQ by FTDI is a 32-terminal peripheral IC with USB bus compatibility. It operates at 3.3-5.25V, -40 to 85°C, and supports an 8-bit external data bus width with a clock frequency of up to 12.02MHz. Ideal for industrial applications requiring microprocessor circuits in compact square chip carrier packages.

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

SoC; Terminal Form: NO LEAD; No. of Terminals: 41; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

CY8CMBR3116-LQXIT by Infineon is a 24-terminal IC with max supply voltage of 1.89V and operating temp up to 85°C. Ideal for industrial applications, this CMOS technology-based microprocessor circuit features a square package style and no-lead terminal form.

FT245RQ-TRAY by FTDI is a 32-terminal chip carrier with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. With a terminal pitch of 0.5 mm, it is ideal for microprocessor circuits requiring supply voltage b/w 3.3 V to 5.25 V.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

ATECC608B-SSHDA-T by Microchip Technology is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85°C, has a supply voltage range of 2-5.5V, and comes in a small outline package suitable for industrial applications.

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;

Other uPs/uCs/Peripheral ICs;

SoC; Terminal Form: BALL; No. of Terminals: 425; Package Code: VFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 60; Package Code: VBCC; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;

CC3200MODR1M2AMOBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 4-Ch 12-Bit ADC Channels. It operates at -20 to 70 °C and supports I2C, SPI, UART Bus Compatibility. Ideal for IoT applications due to its compact CHIP CARRIER package and low power consumption at 3.6V max supply voltage.

NXP's SE050C2HQ1/Z01SDZ is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.62V to 3.6V. This quad-terminal chip carrier is ideal for industrial applications requiring secure authentication.

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Moisture Sensitivity Level (MSL): 3; Terminal Finish: PURE TIN;