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Manufacturer | Intel |
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Manufacturer's Part Number | EP3C10M164C8N |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 164; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | EP3C10M164C8N Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.15 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.2 mm |
No. of Inputs: | 106 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | YES |
No. of Outputs: | 106 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 164 |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
JESD-30 Code: | S-PBGA-B164 |
Maximum Clock Frequency: | 472.5 MHz |
Package Shape: | SQUARE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 8 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | OTHER |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.25 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 10320 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA164,15X15,20 |
Finishing Of Terminal Used: | Tin/Silver/Copper (Sn/Ag/Cu) |
Length: | 8 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | 260 |
Power Supplies (V): | 1.2/3.3 |