Intel - BV80605001908AK/SLBJJ

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 256; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1440; Package Shape: RECTANGULAR; Low Power Mode: NO; Surface Mount: YES;

AT91SAM9G45B-CU by Microchip Technology is a 32-bit microprocessor with 8-bit on-chip data RAM and 26-bit address bus width. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a package style of grid array and thin profile, it offers high performance in a compact form factor.

AT91RM9200-QU-002 by Microchip Technology is a 32-bit ARM7 microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 80 MHz, suitable for industrial applications requiring high-speed processing. With low power mode and 94 I/O lines, it offers efficient performance in compact designs.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 740; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 489; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;

STM32MP135AAF3 by STMicroelectronics is a 32-bit microprocessor with 8-bit RAM width, 26-bit address bus, and 16-bit external data bus. It operates at a max clock frequency of 48 MHz and has low power mode. Ideal for applications requiring high-speed processing in compact devices.

AM3357BZCZD60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 26 MHz max clock frequency. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 90 °C.