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| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | BD82QM57SLGZQ |
| Description | Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 1071; Package Code: HBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1071; |
| Datasheet | BD82QM57SLGZQ Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .998 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.05 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Supply Voltage: | 1.1 V |
| Maximum Seated Height: | 2.358 mm |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Surface Mount: | YES |
| No. of Terminals: | 1071 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Address Bus Width: | 32 |
| Length: | 27 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B1071 |
| Maximum Clock Frequency: | 14.318 MHz |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | HBGA |
| Bus Compatibility: | USB; PCI; I2C; LPC; PS/2 |
| Width: | 25 mm |
| Terminal Pitch: | .6 mm |
