Intel - AV8063801149402SR0T6

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Technology: CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;

MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 361; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

NXP Semiconductors' MCF5251CVM140 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing in a compact square package with ball terminals.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

MCIMX6S1AVM08AC by NXP Semiconductors is a 64-bit microprocessor with 16-bit address bus width, 32-bit external data bus width, and max clock frequency of 24 MHz. Ideal for automotive applications due to its low power mode, CMOS technology, and terminal finish of tin silver copper.

AM3352BZCZD30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates in an extended temperature range from -40 to 90 °C.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 441; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 25 MHz;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 3.3;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 489; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;