Intel - 5CSEBA6U23I7SN

AM4376BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring high performance and reliability.

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC68,.4SQ,20;

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

SLI9670AQ20FW1311XUMA1 by Infineon: Operates at 1.65-1.95V, -40 to 105°C range, AEC-Q100 certified. Ideal for cryptographic authentication applications with CMOS tech, 32 terminals in a square chip carrier package.

The NXP MIMXRT1062CVJ5B is a SoC with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.15-1.26V. With 196 terminals in a low-profile grid array package, it's ideal for applications requiring high performance and compact design.

XC7Z010-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

SYSTEM ON CHIP;

Other uPs/uCs/Peripheral ICs; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 49; Package Code: FBGA; Package Shape: SQUARE;

CY8C6247BZI-D54 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V, making it suitable for various applications requiring a compact GRID ARRAY package style.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

CC3220MODASM2MONR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 4-Ch 12-Bit ADC channels and 256 RAM words. It operates in an INDUSTRIAL temperature grade range from -40 to 85 °C, making it suitable for IoT applications requiring I2C, I2S, SPI, and UART connectivity. With a compact size of 25mm x 20.5mm x 2.41mm, this chip carrier package offers high performance in a small form factor.

EFR32MG21A010F768IM32-B by Silicon Labs is a surface mount system on chip (SoC) with 32 terminals. It operates at a voltage range of 1.71V to 3.8V and can withstand temperatures from -40°C to 125°C. This automotive-grade IC is suitable for various applications requiring low power consumption and compact size.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

EFR32MG12P432F1024IM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip is ideal for applications requiring low-profile, surface-mount components in various electronic systems.

MCIMX6L8DVN10AA by NXP Semiconductors is a 432-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage range of 1.375-1.5V. Ideal for applications requiring thin profile and fine pitch grid array packages.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;