Integrated Silicon Solution - IS66WVH8M8ALL-166B1LI

IS66WVH8M8ALL-166B1LI by Integrated Silicon Solution

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Manufacturer Integrated Silicon Solution
Manufacturer's Part Number IS66WVH8M8ALL-166B1LI
Description PSEUDO STATIC RAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Datasheet IS66WVH8M8ALL-166B1LI Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8MX8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 24
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B24
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TBGA
Width: 6 mm
Memory Density: 67108864 bit
Memory IC Type: PSEUDO STATIC RAM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Length: 8 mm
No. of Words Code: 8M
Nominal Supply Voltage / Vsup (V): 1.8
Peak Reflow Temperature (C): NOT SPECIFIED
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
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