Image shown is a representation only.
| Manufacturer | Integrated Device Technology |
|---|---|
| Manufacturer's Part Number | IDT7280L15PA |
| Description | OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; |
| Datasheet | IDT7280L15PA Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256X9 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 125 mA |
| Cycle Time: | 25 ns |
| Terminal Finish: | Tin/Lead (Sn85Pb15) |
| No. of Terminals: | 56 |
| Maximum Clock Frequency (fCLK): | 40 MHz |
| No. of Words: | 256 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G56 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TSSOP |
| Width: | 6.1 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Memory Density: | 2304 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 9 |
| Output Enable: | NO |
| No. of Functions: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP56,.3,20 |
| Length: | 14 mm |
| Maximum Access Time: | 15 ns |
| No. of Words Code: | 256 |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Additional Features: | RETRANSMIT |
| Peak Reflow Temperature (C): | 240 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 5 |
