Infineon Technologies - SLB9670XQ20FW785XUMA1

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: LFBGA; Package Shape: SQUARE; Width: 19 mm;

SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

ATSHA204A-MAHDA-T by Microchip operates at 2-5.5V, with TS16949 screening and -40 to 85°C temp range. It's a cryptographic authenticator IC in a compact chip carrier package, ideal for secure applications needing high reliability and low power consumption.

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC40,.2SQ,16;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;

XCZU4EV-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package. Suitable for industrial use, it requires a supply voltage of 0.825V to 0.876V and can withstand peak reflow temperature of 245C.

SoC; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;

Other uPs/uCs/Peripheral ICs; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B400;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

ATWINC1510-MR210PB1961 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in a compact rectangular package style.

XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.

PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MCIMX6U5DVM10AB by NXP Semiconductors is a System on Chip with 624 terminals, operating at -40 to +95°C. It has a supply voltage range of 1.35V to 1.5V and uses CMOS technology. Ideal for applications requiring low profile, fine pitch packages in surface mount configurations.

The NXP Semiconductors MIMX8MM6DVTLZAAR is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high processing power in compact spaces.

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;