Infineon Technologies - FM22LD16-55-BG

FM22LD16-55-BG by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number FM22LD16-55-BG
Description FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Data Retention Time: 10;
Datasheet FM22LD16-55-BG Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00027 Amp
Organization: 256KX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
Maximum Supply Current: 12 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 48
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Write Protection: SOFTWARE
Technology: CMOS
JESD-30 Code: R-PBGA-B48
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Endurance: 100000000000000 Write/Erase Cycles
Package Code: TFBGA
Width: 6 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 4194304 bit
Memory IC Type: FRAM
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Package Equivalence Code: BGA48,6X8,30
Length: 8 mm
Maximum Access Time: 110 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Minimum Data Retention Time: 10
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: .75 mm
Maximum Supply Voltage (Vsup): 3.6 V
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