Infineon Technologies - CY15B116QN-40BKXQ

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CY15B116QN-40BKXQ by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY15B116QN-40BKXQ
Description FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 6 mm; Terminal Form: BALL;
Datasheet CY15B116QN-40BKXQ Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00095 Amp
Organization: 2MX8
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.8 V
Surface Mount: YES
Maximum Supply Current: 8 mA
No. of Terminals: 24
Maximum Clock Frequency (fCLK): 40 MHz
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Write Protection: HARDWARE/SOFTWARE
Technology: CMOS
JESD-30 Code: R-PBGA-B24
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Endurance: 1000000000000000 Write/Erase Cycles
Package Code: TBGA
Width: 6 mm
Serial Bus Type: SPI
Memory Density: 16777216 bit
Minimum Standby Voltage: 1.8 V
Memory IC Type: FRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Package Equivalence Code: BGA24,5X5,40
Length: 8 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE
Minimum Data Retention Time: 10
Parallel or Serial: SERIAL
Terminal Pitch: 1 mm
Maximum Supply Voltage (Vsup): 3.6 V
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