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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGT24MR2E6327XUMA1 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR; |
| Datasheet | BGT24MR2E6327XUMA1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 32 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 5.5 mm |
| Technology: | BIPOLAR |
| JESD-30 Code: | R-PQCC-N32 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | HVQCCN |
| Width: | 4.5 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |
