Infineon Technologies - BGC100GN6E6327XTSA1

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BGC100GN6E6327XTSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGC100GN6E6327XTSA1
Description RF AND BASEBAND CIRCUIT; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR; JESD-30 Code: R-XBCC-B6;
Datasheet BGC100GN6E6327XTSA1 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Telecom IC Type: RF AND BASEBAND CIRCUIT
Surface Mount: YES
No. of Functions: 1
No. of Terminals: 6
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
Technology: CMOS
JESD-30 Code: R-XBCC-B6
Package Shape: RECTANGULAR
Terminal Form: BUTT
Package Code: BCC
Moisture Sensitivity Level (MSL): 1
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