General Electric Solid State - CDP1855E

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VQCCN; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

Other Logic ICs;

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

MAX6817EUT+T by Analog Devices is a BICMOS technology IC with 2 functions, 3/5V power supplies, and 6 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. The small outline package has a low profile and shrink pitch design for space-constrained environments.

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

Other Logic ICs; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; Package Code: DIP; Nominal Supply Voltage / Vsup (V): 5; Surface Mount: NO;

GTL2000DGG,118 by NXP Semiconductors is a MOS technology logic IC with 48 terminals in a small outline, thin profile package. It operates at temperatures ranging from -40 to 85 °C and has power supplies of 2.5V and 3.3V. This IC is commonly used in industrial applications requiring high temperature tolerance and compact design.

Other Logic ICs;

BUS DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;