Fujitsu Semiconductor America - MBM27256-25

MBM27256-25 by Fujitsu Semiconductor America

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Manufacturer Fujitsu Semiconductor America
Manufacturer's Part Number MBM27256-25
Description UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WQCCN; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
Datasheet MBM27256-25 Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Organization: 32KX8
Output Characteristics: 3-STATE
Maximum Seated Height: 3.3 mm
Minimum Supply Voltage (Vsup): 4.75 V
Surface Mount: YES
No. of Terminals: 32
No. of Words: 32768 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, WINDOW
Technology: NMOS
JESD-30 Code: R-CQCC-N32
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: WQCCN
Width: 11.43 mm
Memory Density: 262144 bit
Memory IC Type: UVPROM
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 13.97 mm
Maximum Access Time: 250 ns
No. of Words Code: 32K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 5.25 V
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