Broadcom - L7590C

  1. Home
  2. Broadcom - L7590C
L7590C by Broadcom

Image shown is a representation only.

Manufacturer Broadcom
Manufacturer's Part Number L7590C
Description TELEPHONE RINGER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet L7590C Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Telecom IC Type: TELEPHONE RINGER CIRCUIT
Maximum Seated Height: 2.67 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 16
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Nominal Negative Supply Voltage: -170 V
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: SOP
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MC33218ADW by Motorola

MC33218ADW

Motorola

SPEAKER PHONE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
PCD3347P/020 by NXP Semiconductors

PCD3347P/020

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
UBA2050T/C1 by NXP Semiconductors

UBA2050T/C1

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
TA31023P by Toshiba

TA31023P

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
HA16805F by Renesas Electronics

HA16805F

Renesas Electronics

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
KA8603 by Samsung

KA8603

Samsung

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3310ET by NXP Semiconductors

PCD3310ET

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
S5T5820C03-D0B0 by Samsung

S5T5820C03-D0B0

Samsung

TELEPHONE DIALER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
PCD4415ATD by NXP Semiconductors

PCD4415ATD

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
TC35218P by Toshiba

TC35218P

Toshiba

TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
PCD3310EP by NXP Semiconductors

PCD3310EP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
M3541D by STMicroelectronics

M3541D

STMicroelectronics

TELEPHONE DIALER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
935264471518 by NXP Semiconductors

935264471518

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
TA31075F-TP2 by Toshiba

TA31075F-TP2

Toshiba

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD3325CP by NXP Semiconductors

PCD3325CP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
LT1684IN by Analog Devices

LT1684IN

Analog Devices

TELEPHONE RINGER CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1098TV by NXP Semiconductors

TEA1098TV

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
935084920112 by NXP Semiconductors

935084920112

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1064AT/C2 by NXP Semiconductors

TEA1064AT/C2

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
MC34017DR2 by NXP Semiconductors

MC34017DR2

NXP Semiconductors

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;