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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | BCM8124 |
| Description | LOGIC CIRCUIT; Terminal Form: BALL; No. of Terminals: 127; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; |
| Datasheet | BCM8124 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Surface Mount: | YES |
| Logic IC Type: | LOGIC CIRCUIT |
| No. of Functions: | 1 |
| No. of Terminals: | 127 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B127 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Family: | 8124 |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 1 |
