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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | ATTL7597BAU-DT |
| Description | SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; |
| Datasheet | ATTL7597BAU-DT Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | SLIC |
| Maximum Seated Height: | 3.56 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 32 |
| Qualification: | Not Qualified |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| JESD-30 Code: | R-PQCC-J32 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | J BEND |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 225 |
| Package Code: | QCCJ |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
