Analog Devices - HMC170C8TR

DOUBLE BALANCED; Technology: GAAS; Construction: COMPONENT; Terminal Finish: Gold (Au); Package Equivalence Code: DIE OR CHIP; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Maximum Conversion Loss: 10 dB; Construction: COMPONENT; Maximum Input Power (CW): 25 dBm; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel;

TRIPLE BALANCED; Maximum Conversion Loss: 10 dB; Construction: COMPONENT; Package Equivalence Code: DIE OR CHIP; Minimum Operating Frequency: 15000 MHz; Maximum Input Power (CW): 25 dBm;

DOUBLE BALANCED; Minimum Operating Frequency: 24000 MHz; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Construction: COMPONENT; Terminal Finish: Gold Flash (Au) - with Nickel (Ni) barrier;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Minimum Operating Frequency: 1700 MHz;

TRIPLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Minimum Operating Frequency: 600 MHz; JESD-609 Code: e3; Maximum Operating Frequency: 1300 MHz; Maximum Operating Temperature: 85 Cel; Terminal Finish: Matte Tin (Sn) - annealed;

IMAGE REJECTION; Minimum Operating Temperature: -55 Cel; Maximum Operating Frequency: 33000 MHz; Maximum Conversion Loss: 15 dB; Minimum Operating Frequency: 26000 MHz; Maximum Operating Temperature: 85 Cel;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: LCC24,.16SQ,20;

RF/Microwave Mixers; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb);

IMAGE REJECTION; Maximum Input Power (CW): 18 dBm; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Maximum Operating Frequency: 27000 MHz; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Operating Frequency: .5 MHz; Maximum Input Power (CW): 17 dBm;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Package Equivalence Code: LCC40,.24SQ,20;

DOUBLE BALANCED; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb);

DOUBLE BALANCED; Maximum Input Power (CW): 20 dBm; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum Operating Frequency: 1000 MHz; Construction: COMPONENT;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Package Equivalence Code: LCC36,.25SQ,20;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Conversion Loss: 10 dB;

DOUBLE BALANCED; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; Minimum Operating Temperature: 0 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Package Equivalence Code: LCC16,.16SQ,25;