Analog Devices - DS2401A+T&R

MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Form: UNSPECIFIED; Surface Mount: NO; No. of Functions: 1;

MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Operating Mode: ASYNCHRONOUS;

MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

Other Memory ICs;

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; JESD-30 Code: R-XSSS-X;

MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8; No. of Words Code: 1M;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B88;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Terminal Finish: MATTE TIN;

Other Memory ICs;

MEMORY CIRCUIT;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; No. of Words: 16777216 words;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; JESD-609 Code: e3;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;