Advanced Thermal Solutions - ATSEU-077C-C2-R0

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: TRANSVERSE; Width: 13 mm;

Ohmite FA-T220-38E Heat Sink, 38.1mm H, 25mm W, 41.6mm L, ALUM Body, ANOD Finish. Weighs 27g with OMNIDIR fins. Ideal for cooling electronic components in various applications.

Heat Sinks;

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: FOLDEDBACK; Length: .86 mm; Width: .395 mm;

HEAT SINK;

HEAT SINK; Device Used On: IC; Construction: FIN; Height: 10 mm; Length: 35 mm; Finish: BLACK ANODIZED;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Width: 12.7 mm;

HEAT SINK;

HEAT SINK;

HEAT SINK;

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 19.4 mm; Thermal Resistance: 7.8 ohm;

FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FLARED; Fin Orientation: OMNIDIRECT; Color: GREEN; Finish: ANODIZED;

HEAT SINK; Fin Orientation: RADIAL; Finish: ANODIZED; Height: 12.7 mm; Thermal Resistance: 35.2 ohm; Color: BLACK;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;

HEAT SINK;

HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 27 mm;

HEAT SINK; Body Material: ALUMINUM; Color: BLACK; Packing Method: BULK; Width: 12.7 mm; Weight: 18 g;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;

The Ohmite Manufacturing 274-1AB Heat Sink is 9.5mm in height, 13.2mm in width, and 19.1mm in length with an anodized black aluminum finish. Ideal for cooling electronic components in compact spaces like PCBs or LED lighting systems due to its small form factor and efficient heat dissipation capabilities.