Advanced Micro Devices - S29GL256P10TFI010

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S29GL256P10TFI010 by Advanced Micro Devices

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Manufacturer Advanced Micro Devices
Manufacturer's Part Number S29GL256P10TFI010
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP56,.8,20;
Datasheet S29GL256P10TFI010 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Organization: 16MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 80 mA
Command User Interface: YES
No. of Terminals: 56
No. of Words: 16777216 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G56
No. of Sectors/Size: 256
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Memory Density: 268435456 bit
Sector Size (Words): 128K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 8/16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TSSOP56,.8,20
Alternate Memory Width: 8
Common Flash Interface: YES
Maximum Access Time: 100 ns
No. of Words Code: 16M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Data Polling: YES
Power Supplies (V): 3/3.3
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