Telecom - Signaling ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
TC35302P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35307P	Toshiba	TONE DECODER CIRCUIT		THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T8		3.8 mm	7.62 mm	Not Qualified	e0	9.66 mm
TC35300BP	Toshiba	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS	.007 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35306P	Toshiba	TONE DECODER CIRCUIT		THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T8		3.8 mm	7.62 mm	Not Qualified	e0	9.66 mm
TC35301BP	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35305P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T14			7.62 mm	Not Qualified	e0	19.25 mm
TC35311F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20		1.8 mm	5.3 mm	Not Qualified	e0	12.8 mm
TC35310F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20		1.8 mm	5.3 mm	Not Qualified	e0	12.8 mm
TC35302F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20		1.8 mm	5.3 mm	Not Qualified	e0	12.8 mm
HD81806RP	Renesas Electronics	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	75 Cel	-20 Cel		DUAL	R-PDIP-T40		5.06 mm	15.24 mm	Not Qualified		52.8 mm
HD81806RCP	Renesas Electronics	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	75 Cel	-20 Cel		QUAD	S-PQCC-J44		4.6 mm	16.58 mm	Not Qualified		16.58 mm
HA16830F	Renesas Electronics	TONE DECODER CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G20		2.2 mm	5.5 mm	Not Qualified		12.6 mm
HD81806RPW	Renesas Electronics	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T40		5.06 mm	15.24 mm	Not Qualified		52.8 mm
HD81806RCPW	Renesas Electronics	DTMF SIGNALING CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	S-PQCC-J44		4.6 mm	16.58 mm	Not Qualified		16.58 mm
KT3170	Samsung	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm				DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified		22.95 mm
KT3170N	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.009 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified	e0	22.95 mm
S5T3170X01-S0B0	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.009 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Telecom Signaling Circuits	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		12.8 mm
S5T3170X01-D0B0	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.009 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T18	1	5.08 mm	7.62 mm	Not Qualified		22.95 mm
S1T0567X01-D0B0	Samsung	TONE DECODER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE				70 Cel	0 Cel		DUAL	R-PDIP-T8				Not Qualified
KA567D	Samsung	TONE DECODER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8		1.95 mm	3.95 mm	Not Qualified	e0	4.92 mm
KA567L	Samsung	TONE DECODER CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8		1.95 mm	3.9 mm	Not Qualified	e0	4.9 mm
KA567LD	Samsung	TONE DECODER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.95 mm	3.9 mm	Not Qualified	e0	4.9 mm
KA567	Samsung	TONE DECODER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e0	9.2 mm
KT3170J	Samsung	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC	NO		CMOS	9 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T18				Not Qualified	e0
S1T0567X01-S0B0	Samsung	TONE DECODER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G8				Not Qualified
LM567CD	Samsung	TONE DECODER CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0	4.9 mm

Telecom Signaling ICs are electronic components used in telecommunications systems to encode and decode signaling messages used to control and manage the network. These ICs are designed to provide reliable and efficient signaling capabilities, allowing for the efficient operation and management of telecommunication systems.

Telecom Signaling ICs are responsible for generating and interpreting signaling messages, which are used to control call setup, routing, and network management functions. They use various signaling protocols, such as Signaling System 7 (SS7), to encode and decode these messages.

Some common features of Telecom Signaling ICs include:

1. Signaling protocol support: Signaling ICs support various signaling protocols, allowing them to be used in a wide range of telecommunication systems.

2. Signal processing: Signaling ICs are designed to process signals quickly and efficiently, ensuring fast and reliable communication.

3. Error detection and correction: Signaling ICs use error detection and correction techniques to ensure that signaling messages are transmitted and received correctly.

4. Compatibility: Signaling ICs are designed to be compatible with various telecommunication systems, allowing them to be easily integrated into existing networks.

Telecom Signaling ICs are used in a variety of telecommunications systems, including voice and data networks, cellular networks, and IP-based networks. They are also used in network management systems, allowing for the efficient control and management of network resources.