Modems

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
935288611551	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
935234750518	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS				10.3 mm
MC145444P	NXP Semiconductors	MODEM	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS				5 V	5	IN-LINE	DIP20,.3	Modems	2.54 mm	70 Cel	-20 Cel		DUAL		R-PDIP-T20				Not Qualified
935234750118	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS				10.3 mm
MC145443BDW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.01 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e0			12.8 mm
MC145443BP	NXP Semiconductors	MODEM	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS				5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	.0003 Mbps	R-PDIP-T20		4.57 mm	7.62 mm	Not Qualified					26.415 mm
MC145442BP	NXP Semiconductors	MODEM	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			10 mA	5 V	5	IN-LINE	DIP20,.3	Modems	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDIP-T20		4.57 mm	7.62 mm	Not Qualified		e0			26.415 mm
TDA5051T-T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified					10.3 mm
TDA5051TD	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified					10.3 mm
TDA5051AT-T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	DATA RATE MIN:600BPS				10.3 mm
PEF22827ELV1.1	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES							1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B225	3			Not Qualified				235
DM207DAA	Infineon Technologies	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	V.32, V.34 AND V.90 COMPATIBILITY				7.8 mm
PEF22827ELV1.1-G	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES							1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B225				Not Qualified
PMB8787	Infineon Technologies
VDSL6100I	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES							1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B225				Not Qualified
DAA2000	Infineon Technologies	MODEM-SUPPORT CIRCUIT	COMMERCIAL							1					3 V						70 Cel	0 Cel			.056 Mbps					Not Qualified
SAB82511-N	Infineon Technologies	MODEM	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			290 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44				Not Qualified		e0
XMM2051	Infineon Technologies
MAX2395ETI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e0			5 mm
73K324L-28IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28		4.572 mm	11.54 mm	Not Qualified					11.54 mm
MAX2982GCD/V+T	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	AEC-Q100				1.2,3.3	FLATPACK	QFP128,.63X.87,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3			Not Qualified		e3	30	260
MAX2980CCB-T	Maxim Integrated		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS				3.3 V	3.3	FLATPACK	QFP64,.47SQ,20	Modems	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64				Not Qualified		e0
MAX2992GCB/V+T	Maxim Integrated											AEC-Q100
MAX2395EGI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.9 mm	5 mm	Not Qualified		e0			5 mm
73M2901CE-IM/F	Maxim Integrated	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	3			Not Qualified			30	260
DS2245-24	Maxim Integrated	MODEM	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1					5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	.0024 Mbps	R-XSMA-N30				Not Qualified		e0
73K224L-IP	Maxim Integrated	MODEM	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			25 mA	5 V	5	IN-LINE	DIP28,.6	Modems	2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T28				Not Qualified
73K222AL-IH	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.012 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.5062 mm	Not Qualified	FULL DUPLEX				11.5062 mm
73K222BL-IH/F	Maxim Integrated	MODEM		J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			12 mA	5 V		CHIP CARRIER	LDCC32,.5X.6		1.27 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	R-PQCC-J32		3.56 mm	11.455 mm						13.995 mm
DS2245-12	Maxim Integrated	MODEM	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1					5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	.0012 Mbps	R-XSMA-N30				Not Qualified		e0
MAX2982GCD+	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Modems	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	14 Mbps	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm
MAX2395ETI+	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
73K222BL-IHR/F	Maxim Integrated	MODEM		J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			12 mA	5 V		CHIP CARRIER	LDCC32,.5X.6		1.27 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	R-PQCC-J32		3.56 mm	11.455 mm						13.995 mm
73M2901CE-IMR/F	Maxim Integrated	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	3			Not Qualified			30	260
73K324BL-IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.56 mm	11.455 mm	Not Qualified					14 mm
MAX2982GCD/V+	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100				1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Modems	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	14 Mbps	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm
MAX2395ETI-T	Maxim Integrated	MODEM-MODULATOR																					TIN LEAD				1					e0
DS6103	Maxim Integrated	MODEM		THROUGH-HOLE	36	DIP	RECTANGULAR		NO				-5 V		5 V	+-5	IN-LINE	DIP36/40(UNSPEC)	Modems				Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T36				Not Qualified		e0
DS6101	Maxim Integrated	MODEM		THROUGH-HOLE	36	DIP	RECTANGULAR		NO				-5 V		5 V	+-5	IN-LINE	DIP36/40(UNSPEC)	Modems				Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T36				Not Qualified		e0
73M2901CL-IGT/F	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	40	LQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQFP-G40		1.6 mm	10 mm	Not Qualified					10 mm
73M2901CL-IGV/F	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQFP-G32		1.2 mm	7 mm	Not Qualified					7 mm
MAX2395ETI+T	Maxim Integrated	MODEM-MODULATOR																					MATTE TIN									e3
73K324L-28IH/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28		4.572 mm	11.54 mm	Not Qualified					11.54 mm
DS2245-12U	Maxim Integrated	MODEM	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1					5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	.0012 Mbps	R-XSMA-N30				Not Qualified		e0
DS2245M-24	Maxim Integrated	MODEM	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1					5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	.0024 Mbps	R-XSMA-N30				Not Qualified	FULL DUPLEX	e0
73K224L-28IHR/F	Maxim Integrated	MODEM		J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			25 mA	5 V		CHIP CARRIER	LDCC28,.5SQ		1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28		4.572 mm	11.54 mm						11.54 mm
73K224L-28IH/F	Maxim Integrated	MODEM		J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			25 mA	5 V		CHIP CARRIER	LDCC28,.5SQ		1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28		4.572 mm	11.54 mm						11.54 mm
73K224BL-IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.56 mm	11.455 mm	Not Qualified					13.995 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.