Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Broadcom |
IMAGE REJECTION |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
8 dB |
5000 MHz |
30000 MHz |
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Infineon Technologies |
DOUBLE BALANCED |
SURFACE MOUNT |
5 |
PLASTIC/EPOXY |
GAAS |
17 dBm |
COMPONENT |
3 |
TSOP5/6,.11,37 |
50 ohm |
RF/Microwave Mixers |
Tin/Lead (Sn/Pb) |
7.5 dB |
e0 |
500 MHz |
2500 MHz |
||||||||
|
Analog Devices |
IMAGE REJECTION |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
24000 MHz |
28000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
LCC16,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
24000 MHz |
28000 MHz |
||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
8.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
6000 MHz |
14000 MHz |
|||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
11.5 dB |
10000 MHz |
20000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
10 |
PLASTIC/EPOXY |
15 dBm |
46 mA |
COMPONENT |
3.3 |
LCC10,.08SQ,20 |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
.03 MHz |
7000 MHz |
|||||||
M/a-com Technology Solutions |
TRIPLE BALANCED |
COAXIAL |
50 ohm |
100 Cel |
-54 Cel |
11.5 dB |
SMA, I/P POWER-MAX (PEAK)=26DBM |
2000 MHz |
18000 MHz |
|||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BIPOLAR |
MODULE |
+-5 |
LDCC20,.4SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
|||||||||
L-3 Narda-miteq |
DOUBLE BALANCED |
2.5 |
COAXIAL |
85 Cel |
-54 Cel |
9 dB |
SMA-F |
1000 MHz |
18000 MHz |
|||||||||||||||
L-3 Narda-miteq |
DOUBLE BALANCED |
2.5 |
COAXIAL |
85 Cel |
-54 Cel |
9 dB |
SMA-F |
1000 MHz |
18000 MHz |
|||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
15 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
1 MHz |
6000 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
20 dBm |
150 mA |
COMPONENT |
3.3 |
LCC12,.08X.12,20 |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
3000 MHz |
20000 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
10000 MHz |
20000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
TSSOP8,.19 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
10 dB |
e3 |
4500 MHz |
9000 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
BIPOLAR |
2 |
75 mA |
COMPONENT |
5 |
TSSOP14,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
0 MHz |
2500 MHz |
|||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
3 |
TSSOP8,.19 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
600 MHz |
1300 MHz |
|||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
15 dBm |
112 mA |
COMPONENT |
3.3/5 |
LCC16,.16SQ,25 |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
3000 MHz |
8000 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
13.5 dB |
24000 MHz |
34000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
CMOS COMPATIBLE |
e3 |
2000 MHz |
14000 MHz |
||||||||||||
M/a-com Technology Solutions |
DOUBLE BALANCED |
17 dBm |
50 ohm |
100 Cel |
-55 Cel |
8.5 dB |
10 MHz |
2500 MHz |
||||||||||||||||
Motorola |
DOUBLE BALANCED |
THROUGH HOLE MOUNT |
14 |
PLASTIC/EPOXY |
ECL |
16 mA |
DIP14,.3 |
RF/Microwave Mixers |
85 Cel |
-30 Cel |
Tin/Lead (Sn/Pb) |
e0 |
||||||||||||
|
Broadcom |
IMAGE REJECTION |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
8 dB |
5000 MHz |
30000 MHz |
||||||||||||||
|
Broadcom |
IMAGE REJECTION |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
8 dB |
5000 MHz |
30000 MHz |
||||||||||||||
|
Broadcom |
SINGLE BALANCED |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
12 dB |
18000 MHz |
45000 MHz |
||||||||||||||
|
Broadcom |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
12 dB |
18000 MHz |
40000 MHz |
|||||||||
|
Skyworks Solutions |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
420 mA |
COMPONENT |
5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
HIGH RELIABILITY |
e4 |
700 MHz |
1000 MHz |
||||
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
1700 MHz |
2200 MHz |
|||||||||||||
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
2300 MHz |
2700 MHz |
|||||||||||||
|
Skyworks Solutions |
|||||||||||||||||||||||
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
HIGH RELIABILITY |
700 MHz |
1000 MHz |
||||||||||||||
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
85 Cel |
-40 Cel |
HIGH RELIABILITY |
390 MHz |
500 MHz |
|||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
20 dBm |
200 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
LOW NOISE |
e3 |
10 MHz |
6000 MHz |
|||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) |
9 dB |
e4 |
4000 MHz |
8000 MHz |
||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
8.5 dB |
e3 |
3500 MHz |
8000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
10 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
18 dB |
e4 |
24000 MHz |
34000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
40 mA |
4 |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
TSSOP8,.19 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
|||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
13 dB |
22000 MHz |
32000 MHz |
||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
6000 MHz |
14000 MHz |
|||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
10000 MHz |
20000 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
23 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15 dB |
20000 MHz |
42000 MHz |
||||||||||||||
Texas Instruments |
THROUGH HOLE MOUNT |
14 |
CERAMIC |
BIPOLAR |
DIP14,.3 |
RF/Microwave Mixers |
70 Cel |
0 Cel |
||||||||||||||||
Texas Instruments |
THROUGH HOLE MOUNT |
14 |
CERAMIC |
BIPOLAR |
DIP14,.3 |
RF/Microwave Mixers |
70 Cel |
0 Cel |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.