Microchip Technology XO Clock Oscillators 646

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Part	Manufacturer	Oscillator Type	Mounting Feature	No. of Terminals	Frequency Stability	Frequency Adjustment (Mechanical)	Maximum Supply Voltage	Technology	Output Load	Maximum Supply Current	Nominal Supply Voltage	Package Equivalence Code	Maximum Rise Time	Physical Dimension	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Nominal Operating Frequency	Maximum Fall Time	Maximum Symmetry (%)	Maximum Output Low Current	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
DSC1201DI3-50M00000	Microchip Technology	CMOS	SURFACE MOUNT	6	20 %	NO	3.63 V		15 pF					2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel		50 MHz		55/45		STANDBY; ENABLE/DISABLE FUNCTION; BULK
DSC1222DI2-156M2500	Microchip Technology	LVPECL	SURFACE MOUNT	6	25 %	NO	3.63 V		50 OHM				.25 ms	2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel		156.25 MHz	.3 ns	52/48		ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK
DSC1223DI2-148M5000	Microchip Technology	LVPECL	SURFACE MOUNT	6	25 %	NO	3.63 V		100 OHM				.22 ms	2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel	MATTE TIN	148.5 MHz	.22 ns	52/48		ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK	e3
DSC1223DI2-212M5000	Microchip Technology	LVDS	SURFACE MOUNT	6	25 %	NO	3.63 V		100 OHM				.22 ms	2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel		212.5 MHz	.22 ns	52/48		ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK
DSC6001HI3B-032K768	Microchip Technology	CMOS	SURFACE MOUNT	4	20 %	NO	3.63 V		10 pF				2 ms	1.6mm x 1.2mm x 0.89mm	1.71 V	85 Cel	-40 Cel		.032768 MHz	2 ns	55/45		ENABLE/DISABLE FUNCTION; BAG
DSC6001HI3B-032K768T	Microchip Technology	CMOS	SURFACE MOUNT	4	20 %	NO	3.63 V		10 pF				2 ms	1.6mm x 1.2mm x 0.89mm	1.71 V	85 Cel	-40 Cel		.032768 MHz	2 ns	55/45		ENABLE/DISABLE FUNCTION; TR
DSC6003HI2A-048.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	1.6mm x 1.2mm x 0.89mm	1.71 V	85 Cel	-40 Cel		48 MHz	3.5 ns	60/40		AEC-Q100; ENABLE/DISABLE FUNCTION; BULK
DSC6003HI2A-048.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	1.6mm x 1.2mm x 0.89mm	1.71 V	85 Cel	-40 Cel		48 MHz	3.5 ns	60/40		AEC-Q100; ENABLE/DISABLE FUNCTION; TR
DSC6003HI2B-012.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	1.6mm x 1.2mm x 0.89mm	1.71 V	85 Cel	-40 Cel	NICKEL GOLD	12 MHz	3.5 ns	55/45		ENABLE/DISABLE FUNCTION; BAG	e4
DSC6003HI2B-024.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	1.6mm x 1.2mm x 0.89mm	1.71 V	85 Cel	-40 Cel	NICKEL GOLD	24 MHz	3.5 ns	55/45		ENABLE/DISABLE FUNCTION; TR	e4
DSC6003JI2B-024.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel	GOLD OVER NICKEL	24 MHz	3.5 ns	55/45		ENABLE/DISABLE FUNCTION; TUBE	e4
DSC6003JI2B-032K768	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel	GOLD OVER NICKEL	.032768 MHz	3.5 ns	55/45		ENABLE/DISABLE FUNCTION; TUBE	e4
DSC6003MA3B-032K768	Microchip Technology	CMOS	SURFACE MOUNT	4	20 %	NO	3.63 V		5 pF				3.5 ms	2.0mm x 1.6mm x 0.89mm	1.71 V	125 Cel	-40 Cel		.032768 MHz	3.5 ns	55/45		AEC-Q100; ENABLE/DISABLE FUNCTION; BAG
DSC6011JI1A-024.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	3.63 V		10 pF				2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel		24 MHz	2 ns	55/45		AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR
DSC6011JI1B-025.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	3.63 V		10 pF				2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel	GOLD OVER NICKEL	25 MHz	2 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; TUBE	e4
DSC6013JE2A-025.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	70 Cel	-20 Cel	GOLD OVER NICKEL	25 MHz	3.5 ns	55/45		AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR	e4
DSC6013JI2A-012.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel	GOLD OVER NICKEL	12 MHz	3.5 ns	55/45		AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR	e4
DSC6083CI2A-002K000	Microchip Technology
DSC6083CI2A-032K768	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		5 pF				3.5 ms	3.2mm x 2.5mm x 0.85mm	1.71 V	85 Cel	-40 Cel		.032768 MHz	3.5 ns	55/45		AEC-Q100; BULK
DSC6083CI2A-032K768T	Microchip Technology
DSC6101JI2A-050.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		10 pF				2.2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel		50 MHz	2.2 ns	55/45		ENABLE/DISABLE FUNCTION; TR
DSC6101JI2B-025.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		10 pF				2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel		25 MHz	2 ns	55/45		ENABLE/DISABLE FUNCTION; TUBE
DSC6101JL3B-050.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	20 %	NO	3.63 V		10 pF				2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	105 Cel	-40 Cel	MATTE TIN	50 MHz	2 ns	55/45		ENABLE/DISABLE FUNCTION; TUBE	e3
DSC6101MI2A-024.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		10 pF				2.2 ms	2.0mm x 1.6mm x 0.89mm	1.71 V	85 Cel	-40 Cel		24 MHz	2.2 ns	55/45		ENABLE/DISABLE FUNCTION; TR
DSC6101ML3B-025.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	20 %	NO	3.63 V		10 pF				2 ms	2.0mm x 1.6mm x 0.89mm	1.71 V	105 Cel	-40 Cel	GOLD OVER NICKEL	25 MHz	2 ns	55/45		AEC-Q100; ENABLE/DISABLE FUNCTION; BAG	e4
DSC6101ML3B-027.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	20 %	NO	3.63 V		10 pF				2 ms	2.0mm x 1.6mm x 0.89mm	1.71 V	105 Cel	-40 Cel	MATTE TIN	27 MHz	2 ns	55/45		ENABLE/DISABLE FUNCTION; BAG	e3
DSC6102CI2A-100.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		15 pF				1.5 ms	3.2mm x 2.5mm x 0.85mm	1.71 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	100 MHz	1.5 ns	55/45		AEC-Q100; ENABLE/DISABLE FUNCTION; TR	e4
DSC6102HI2B-025.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		15 pF				1.5 ms	1.6mm x 1.2mm x 0.9mm	1.71 V	85 Cel	-40 Cel		25 MHz	1.5 ns	55/45		ENABLE/DISABLE FUNCTION; BAG
DSC6112JI2B-032K768T	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		15 pF				1.5 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel	MATTE TIN	.032768 MHz	1.5 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; TR	e3
DSC6183CI2A-032K768	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V	CMOS	10 pF	3 mA			2.2 ms	3.2mm x 2.5mm x 0.85mm	1.71 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	.032768 MHz	2.2 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION	e4
DSC6311JI1DB-100.0000T	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	3.63 V		10 pF				2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel		100 MHz	2 ns	55/45		AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR
DSC6311JI2FB-100.0000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	3.63 V		10 pF				2 ms	2.5mm x 2.0mm x 0.89mm	1.71 V	85 Cel	-40 Cel		100 MHz	2 ns	55/45		AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE
DSC8001CI1	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO			10 KOHM, 15 pF		1.8 V		3 ms	3.2mm x 2.5mm x 0.85mm		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		3 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE	e4	1 MHz	150 MHz
DSC8001CI5	Microchip Technology	CMOS	SURFACE MOUNT	4	10 %	NO			10 KOHM, 15 pF		1.8 V		3 ms	3.2mm x 2.5mm x 0.85mm		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		3 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE	e4	1 MHz	150 MHz
DSC8001CL2	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO			10 KOHM, 15 pF		1.8 V		3 ms	3.2mm x 2.5mm x 0.85mm		105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		3 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE	e4	1 MHz	150 MHz
DSC8001CL5	Microchip Technology	CMOS	SURFACE MOUNT	4	10 %	NO			10 KOHM, 15 pF		1.8 V		3 ms	3.2mm x 2.5mm x 0.85mm		105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		3 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE	e4	1 MHz	150 MHz
DSC8001DI5	Microchip Technology	CMOS	SURFACE MOUNT	4	10 %	NO			10 KOHM, 15 pF		1.8 V		3 ms	2.5mm x 2.0mm x 0.85mm		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		3 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE	e4	1 MHz	150 MHz
DSC8001DL5	Microchip Technology	CMOS	SURFACE MOUNT	4	10 %	NO			10 KOHM, 15 pF		1.8 V		3 ms	2.5mm x 2.0mm x 0.85mm		105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		3 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE	e4	1 MHz	150 MHz
DSC8101BI2	Microchip Technology	CMOS	SURFACE MOUNT		25 %	NO	3.6 V		15 pF				2 ms	5.0mm x 3.2mm x 0.85mm	2.25 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		2 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; TUBE	e4	10 MHz	170 MHz
DSC8103DI2	Microchip Technology
DSC8123BI2	Microchip Technology	LVDS	SURFACE MOUNT		25 %	NO	3.6 V		50 OHM, 2 pF				.2 ms	5.0mm x 3.2mm x 0.85mm	2.25 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		.2 ns	52/48		ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TUBE	e4	10 MHz	460 MHz
DSC8123BI5	Microchip Technology	LVDS	SURFACE MOUNT		10 %	NO	3.6 V		50 OHM, 2 pF				.2 ms	5.0mm x 3.2mm x 0.85mm	2.25 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		.2 ns	52/48		ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TUBE	e4	10 MHz	460 MHz
HT-MM900AC-7K-EE-16M0000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	3.63 V				3.3 V	SOLCC4,.1,43	3 ms	2.5mm x 2.0mm x 0.75mm	2.97 V	125 Cel	-55 Cel		16 MHz	3 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
HT-MM900AC-7K-JE-25M0000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	1.98 V				1.8 V	SOLCC4,.1,43	3.5 ms	2.5mm x 2.0mm x 0.75mm	1.62 V	125 Cel	-55 Cel		25 MHz	3.5 ns	55/45	2 Amp	ENABLE/DISABLE FUNCTION
M55310/16-B41A32M00000	Microchip Technology	TTL	THROUGH HOLE MOUNT	14	50 %	NO					5 V			20.32mm x 12.7mm x 5.08mm		125 Cel	-55 Cel		32 MHz
M55310/16-B44A48M00000	Microchip Technology	TTL	THROUGH HOLE MOUNT		100 %	NO	5.5 V		6 TTL		5 V		5 ms		4.5 V	125 Cel	-55 Cel		48 MHz	5 ns	60/40
MO-9000AE-7K-EE-16M0000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	3.63 V			4.5 mA	3.3 V	DILCC4,.1,43	2 ms	2.5mm x 2.0mm x 0.75mm	2.97 V	85 Cel	-40 Cel		16 MHz	2 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
MO-9200AE-D3K-EE156M25000	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO	3.63 V			69 mA	3.3 V	SOLCC6,.12	.5 ms	5.0mm x 3.2mm x 0.75mm	2.97 V	85 Cel	-40 Cel		156.25 MHz	.5 ns	55/45		COMPLEMENTARY OUTPUT; ENABLE/DISABLE FUNCTION

XO Clock Oscillators

Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.

One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.

XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.

Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.